1. 2. 3. material content data sheet sales product name ipd90n06s4l-06 issued 29. august 2013 ma# MA000484706 package pg-to252-3-11 weight* 391.39 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.466 0.63 0.63 6300 6300 leadframe non noble metal iron 7439-89-6 0.140 0.04 357 inorganic material phosphorus 7723-14-0 0.042 0.01 107 non noble metal copper 7440-50-8 139.706 35.70 35.75 356952 357416 wire non noble metal aluminium 7429-90-5 3.853 0.98 0.98 9845 9845 encapsulation organic material carbon black 1333-86-4 1.443 0.37 3688 plastics epoxy resin - 25.258 6.45 64534 inorganic material silicondioxide 60676-86-0 117.629 30.05 36.87 300546 368768 leadfinish non noble metal tin 7440-31-5 3.740 0.96 0.96 9556 9556 plating non noble metal nickel 7440-02-0 0.091 0.02 232 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 233 solder noble metal silver 7440-22-4 0.060 0.02 154 non noble metal tin 7440-31-5 0.048 0.01 123 non noble metal lead 7439-92-1 2.297 0.59 0.62 5869 6146 heatspreader inorganic material phosphorus 7723-14-0 0.028 0.01 73 non noble metal iron 7439-89-6 0.095 0.02 242 non noble metal copper 7440-50-8 94.488 24.14 24.17 241421 241736 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
